Monday 1st September 2008
Afternoon Short Courses (14:00 - 17:30)
Location: Queen Anne Court (Register at the ESTC-2008 registration desk on the ground floor)
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Rapid progress in the field of organic semiconductors makes the vision of most-plastic integrated circuits reachable. Cost requirements of organic electronic imply that for manufacturing also very cost-effective processes like fast-sheet or roll-to-roll must be used. Polytronics can be based on a hybrid approach a so-called "most-polymer" and "partially-printed" approach.

Application of such in-line production enables to combine standard electronic assembly like silicon chips and components on flexible substrates with polymer electronics towards a heterogeneous system integration platform. Silicon chips can be thinned to make them as flexible as a foil. Also board technologies, for example high-density-interconnect (HDI), can already be fabricated as a flexible foil.

Polymer-based sensors and actuators are developed and also so called Plastic-MEMS devices incorporating mechanical, fluidic and optical components are possibly available within the next years.

In fact "Polytronics" could be a kind of merge where finally elements of all these technologies will open a new flexible large area hetero-integration technology platform for electronic multi-functional systems towards the vision of "Smart Plastics".

Content includes:

• Basics
• Micro structuring on foil substrates
• Materials & processing
• Device and circuits
• Multi-functional system hetero-integration on foil substrates
• Application examples

Those interested in organic electronics and materials, organic electronic devices and circuits, flexible emerging and advanced packaging technologies, and cost-efficient manufacturing on foil substrates

Gerhard Klink studied physics with focus on surface science at the Technical University Munich. 1987 he joined the Fraunhofer Society, where he developed thick and thin film technology for electronic packaging, hybrid circuits, sensors and actuators. Since 1998 he is concerned with process development for flexible electronic systems and reel-to-reel manufacturing methods.

The course aims to provide a nearly exhaustive taxonomy of the failure modes occurring in MEMS with illustrated examples on how these failures occur. It also provides a methodology based on FMEA, used extensively in automotive engineering, on how to tackle the severity of such failures. The course aims also to demonstrate the benefits of high level design of failures as applied to specific case studies.

MEMS manufacturers and end users. It will also provide valuable information to MEMS designers and those engineers specialised in the packaging of MEMS. This tutorial is also a gentle introduction to reliability of MEMS.

Prof. Marc Desmulliez is the Director of the MicroSystems Engineering Centre (MISEC) which regroups 6 permanent academic members of staff and over 30 Ph.D. and Research Associates. The group is specialised in UV-LIGA processing, high level design of Microsystems and advanced packaging of MEMS. He is currently the Head of the Electrical Engineering Department at Heriot-Watt University. Mr. Srikanth Lavu has been involved in failure modes of MEMS for over 3 years in the context of a Ph.D. in high level design of MEMS.

The market dynamics driving the development of advanced substrates in today's industry landscape will be described in terms of technology supply chain matching:  assembly technology, substrate technology and system technology.  Two technological directions of substrates for advanced electronic packages will be mapped out: miniaturization and functional integration, and will be explained in terms of 'More Moore' and 'More than Moore', respectively. Substrate technology roadmaps of leading Japanese suppliers will be reviewed with examples/ illustrations of applications in servers, hand helds, and high end servers and communication equipments: PoP, Embedded Active Devices, Si interposers and Wafer Level Packages, etc.

Content includes:

• Industry landscape
• Technology supply chain matching -- assembly technology, substrate technology,  system technology
• Market dynamics driving package and substrate development
• Technology 'r'evolution shift from CPU to mobile applications
• Maturing of buildup substrate technology
• Package miniaturization and functional integration representing 'More Moore' and 'More than Moore'
• Substrates for fine pitch assembly applications
• Embedded active/passive substrates
• Examples/ illustrations of advanced substrate applications in servers, hand helds, and high end servers and communication equipments:  PoP (Package on Package), EAD (Embedded Active Devices), Si interposers, WLP (Wafer Level Packages), etc.

The course is designed for application designers and developers, package developers as well as substrate development and manufacturing engineers to understand the market dynamics driving package development trends and to provide a direction for future package and substrate requirements.

Henry Utsunomiya is a globally recognized authority in semiconductor wafer technology marketing as well as in PBGA, MCM-L and other IC packaging substrate technologies. In his 25 year career he has been active in international electronics/ semiconductor standards and forecasting committees of: IPC, SIA, EIAJ, JIEP, as well as the roadmap committees of Jisso & ITRS. Mr. Utsunomiya is licensed by the Japanese Government as an enterprise business consultant.

Bernd Appelt, PhD in Polymer Science of the University of Mainz, Germany,  held various management positions in development and manufacturing over the course of his 23 years career in IBM.  He joined ASE in 2003 as Director of Materials Engineering .  Bernd is a member of the Assembly and Packaging ITWG of ITRS as well as the Substrate TWG of iNEMI and holds more than 50 patents.

Computational Fluid Dynamics (CFD) permits to rapidly generate and assess electronic thermal designs, but many factors need to be taken into consideration which impact on predictive accuracy.  In addition, experimentation is required to validate numerical models.  This course covers the application of both experimental and numerical methods to optimize thermal designs.

This course is structured in two parts:

Part 1: Numerical Modeling

• Thermal design methods:
  • Physical prototyping, Predictive methods, CFD analysis.
• CFD fundamentals:
  • Governing equations, Turbulence modeling.
• System-level modeling:
  • Computational constraints, Modeling methodologies, Extraction of board-level boundary conditions.
• Board-level modeling:
• Component and PCB modeling, Computational domain, Grid discretization, Fluid flow modeling.
• Case studies for the analysis of multi-component PCB heat transfer.
• Summary and discussions.

Part 2: Experimental Characterization

• The need for experimentation:
  • Characterization of electronics thermal performance for reliability, Supporting analysis for numerical modeling.
• Uncertainty analysis.
• Measurement Techniques:
  • Temperature, Velocity, Flow rate, and Pressure measurement.
• Thermal characterization environments:
  • Wind tunnel, Fan characterization unit, Enclosures.
• Component thermal characterization:
  • Junction-to reference thermal resistance measurement, Component junction temperature measurement.
• Unit level characterization:
  • Heat sink thermal characterization, Fan performance, Grilles, vents.
• System thermofluid characterization:
  • Prototype mock-up design, System flow impedance measurement.
• Electronics thermal characterization case studies:
• Multi-component printed circuit board, Mobile phone, Telecommunication cabinet.
• Summary and discussions.

Engineers, managers and scientists involved in the thermal management, thermo-mechanical issues or reliability of electronics systems. It is aimed at participants with varying expertise levels in thermal management, from novice to advanced. The course aims to give a balanced expectation on the use of CFD.

Dr. Peter Rodgers is Associate Professor of Mechanical Engineering at the Petroleum Institute in Abu Dhabi, United Arab Emirates.  He is a specialist in electronics thermal management with over fifteen years industry and research experience.  Dr. Rodgers was formally with the Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, USA; Nokia Research Center, Finland; and Electronics Thermal Management, Ltd., Ireland.  In these positions he has been actively involved in electronics cooling and reliability, including health monitoring of electronics.  Dr. Rodgers has authored or co-authored over 60 journal and conference publications in these areas.

Components and modules for optical communication systems and interconnects are continuously advancing in terms of speed, lower cost, and design for high volume manufacturing. This course gives a comprehensive overview of optical components and modules used in state-of-the-art transmission systems from long-haul to short distance. The workshop describes advantages and limitations of photonic components for the specific applications.

Content includes:

• Introduction: modern optical transmission systems from long-haul to short distance
• Light emitting diodes (LEDs): principle of operation and applications
  • Resonant cavity LEDs
• Laser diodes: basic design and operation
  • Fabry-Perot laser diodes (structure, fabrication, performance)
  • Distributed Feedback (DFB) lasers (properties, fabrication)
  • Vertical-cavity surface-emitting lasers (VCSELs: 650nm, 850nm, 1300/1550nm)
  • Tunable lasers (tuning mechanism, applications)
• Modulators: different types and speed limitations
  • Mach-Zehnder modulator
  • Electro-absorption modulator
• Photodetectors: the receiving side of a transmission system
  • PIN photodiodes (bandwidth limitation)
  • Avalanche photodiodes (gain and noise performance)
  • Other photodiodes: MSM photodetectors, traveling wave photodetectors, heterodyne detection
• Integration: technical challenges and economic boundary conditions
  • Types of integration and limitations
  • Laser diode and electro-absorption modulator
• Packaging technology for communication components
  • Butterfly Packages
  • TO-Can
  • Leadframe based plastic packages
• Modules
  • Datacom modules (1x9, SFP, 10Gb/s modules)
  • Parallel optical link modules
  • Fiber optic transceivers for plastic optical fiber (POF)
• Reliability of optical components
• High temperature life time test matrix
• Environmental stability testing
• Future trends

Engineers and technical managers who want to gain a fundamental understanding of the characteristics of the various components and modules used in modern and future optical transmission systems.

Dr. Torsten Wipiejewski is Chief Operations Officer at Firecomms Ltd. based in Cork, Ireland. Prior to Firecomms he was Vice President and R&D director of the  Photonic Components group at ASTRI in Hong Kong, Director of Advanced Technology and Program Manager at Agility Communications in Santa Barbara, California and General Manager of the Infineon Fiber Optics Optoelectronic Components Group in Munich, Germany. Torsten received a "summa cum laude" Ph.D. degree from the University of Ulm, Germany. He chaired the Optoelectronics Chip-Level Roadmap development for the U.S.-based National Electronics Manufacturing Initiative (iNEMI) in 2004. A senior member of IEEE LEOS and CPMT, Torsten has authored or co-authored more than 120 publications and over 30 patents.