Monday 1st September 2008
Morning Short Courses (8:30 - 12:00)
Location: Queen Anne Court (Register at the ESTC-2008 registration desk on the ground floor)
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Electrical circuit analysis and modelling of IC packages are necessary to accurately simulate the response of the assembled device. While models of discrete components are readily available from manufacturers, models of integrated circuit packages containing reactive parasitics are much harder to obtain. This course will provide the concepts of analyzing and electrically modelling the IC package and investigating the impact these effects have on signal integrity.

This course will be beneficial to engineers, scientists and managers involved with the IC package design. It will provide a basic understanding of the electrical effects the IC package has on the performance of the circuit contained within. Circuit designers will also benefit from this course since the knowledge gained will allow them to design circuits considering the effects of the IC package.

Michael Caggiano, Professor Emeritus from Rutgers University, NJ, USA, received his Ph.D. from UCLA in 1979. He is a former member of the technical staff of Bell Laboratories, Murray Hill, NJ where he was the subject matter expert of electrical packaging of high performance and microwave IC's.

Electrically conductive adhesives provide viable alternatives to no-Pb solders in many applications for the RoHS world. An informed decision of which to use in a specific case requires a fundamental understanding of the materials and their failure modes.

The course explores both isotropic and anisotropic conductive adhesives (ICAs and ACAs,) and anisotropic conductive films (ACFs) in a comprehensive coverage of the technologies in terms of basic scientific principles. Ultimately, however, the primary topic of the course is the understanding of failure mechanisms for improvement of reliability. The objective is for attendees to take away an understanding of the basic principles of operation of each technology, and knowledge of their more common failure modes, with the resulting ability to maximise reliability.

Content includes:

• Environmental pressures and solder
• Isotropic conductive adhesives
• Anisotropic conductive adhesives
• Non-conductive adhesives
• Materials: polymers and metals
• Adhesion

Anisotropic Conductive Adhesives and Film

• Hard spheres and polymer beads; random distributions
• Electrical and mechanical modelling; failure modes
• Processing for reliability
• ACF technologies for reliability

Isotropic Conductive Adhesives

• ICA Structure
• Percolation & electrical modelling
• Electrical properties and testing
• Mechanical properties
• Processing for reliability
• Reliability: Moisture and galvanic corrosion
• Reliability: Mechanical and thermo-mechanical
• Thermal properties and reliability

The course will be beneficial to electrical, mechanical, and materials engineers alike, or any one with an interest in electronic device design, fabrication, assembly, or application. The level will be accessible to students and graduates in any of these areas, or the physical sciences.

James E. Morris is a Professor of Electrical & Computer Engineering at Portland State University, Oregon, Professor Emeritus at the State University of New York at Binghamton, and an IEEE Fellow.  He has served as Department Chair at both Binghamton and Portland, and was the first Director of Binghamton's Institute for Research in Electronics Packaging.  Professor Morris was Treasurer of the IEEE Components, Packaging, and Manufacturing Technology Society from 1991 until 1997, Vice-President for Conferences from 1998 until 2003, is now an IEEE-CPMT Distinguished Lecturer, and won the 2005 CPMT David Feldman Outstanding Contribution Award. He is an Associate-Editor of the IEEE Transactions on Components and Packaging Technology.

Research scientists, professional engineers and technical managers involved in IC packaging, component assembly, materials and processing, contract manufacturing and marketing. The information provides the attendees with practical understanding of the design, materials, processes, and reliability issues of high density interconnects in advanced packaging.

Professor Ricky Lee received his PhD from Purdue University. He is Director of Centre for Advanced Microsystems Packaging at Hong Kong University of Science and Technology. He is IEEE and ASME Fellow, and Distinguished Lecturer of IEEE CPMT Society.

Thermally induced failures in electronic and photonic equipment can be predicted and prevented only provided that predictive modeling and accelerated life testing are consistently used in addition, and, desirably, prior, to qualification testing. Analytical thermal stress modeling can provide, in addition to FEA-based modeling, valuable insight into the physics of thermally induced stresses and possible failures.

Content includes:

• Thermal Stress Problem
• Thermal Stress Modeling
• Timoshenko's Bi-Metal Thermostat Theory
• Bi-Material Assemblies: Extension of Timoshenko's Model
• Die-Substrate Assemblies
• Analytical vs. Finite-Element Modeling
• Solder Joints
• "Global" and "Local" Thermal Mismatch Induced Stress
• Assemblies with Low Modulus Adhesives at the Ends
• Design Recommendations
• Thermally Matched Assemblies
• Thin Films
• Bow in Plastic Packages and Bow-Free Assemblies
• Opto-Electronic and Photonic Systems
• Nanosystems
• Accelerated Life Testing of an Assembly Subjected to Thermal Stresses

Engineers, scientists, technical managers, students and professors involved in the mechanical behaviour, performance & reliability of electronics and photonics materials, assemblies, packages and systems subjected to thermal loading

Dr. Suhir is on the faculty of the Electrical Engineering Department, University of California at Santa Cruz. He has authored about 250 technical publications (papers, book chapters, books, patents), including monographs "Structural Analysis of Microelectronic and Fiber Optic Systems". Dr. Suhir is Member-at-Large of the IEEE Technical Activity Board (TAB), New Technologies Directions Committee (NTDC) and Co-Chairman of its Group on Portable Information Devices. He is also Distinguished Lecturer of the IEEE CPMT Society and Member of the Editorial Board of the IEEE CPMT Transactions on Advanced Packaging.