Baroness Blackstone took up the post as Vice-Chancellor of the University of Greenwich in 2004. Formerly UK Government Minister for the Arts (2001-3) and Minister of State for Education & Employment (1997-2001), Tessa Blackstone was Master of Birkbeck College (1987-97) and Deputy Education Officer of the Inner London Education Authority (1983-86). She has also worked as a policy adviser in the UK Cabinet Office. In 1987 Tessa Blackstone was awarded a life peerage and in 2001 she was appointed to the Privy Council. She has served as chairman of the ballet board of the Royal Opera House, the Fabian Society and the Institute for Public Policy Research and has sat on the governing bodies of numerous other organisations.

 

Lewis Terman received the B.S. in Physics and the M.S. and Ph.D. degrees in EE from Stanford in 1956, 1958, and 1961 respectively.  He joined the IBM Research Division in 1961, where he has worked on solid-state circuits, semiconductor technology, memory design and technology, digital and analogue circuits, and processor design. He received nine major IBM technical awards, including three Corporate awards.  He was elected to the IBM Academy of Technology in 1991, and served as president in 2001-2003.  He became Associate Director, IBM Research Systems Department in 2003.  He is a member of the US National Academy of Engineering.

 

William Chen (Bill) holds the position of Senior Technical Advisor at ASE (U.S.) Inc. Prior to joining the ASE Group, he was the Director and Principal Research Fellow at the Institute of Materials Research & Engineering (IMRE) in Singapore. He worked for over thirty three years in various R&D and management positions at IBM Corporation. He was elected to the IBM Academy of Technology. He is the co-chair of the International Technology Roadmap for Semiconductors (ITRS) Assembly and Packaging International Technical Working Group. He has been an associate editor of the IEEE/CPMT transactions, and ASME Journal of Electronic Packaging. He has published extensively in the fields of microelectronics packaging and mechanics of materials. He is the President of the IEEE Components Packaging and Manufacturing Technology Society (CPMT), the global professional society for Electronic Packaging professional. He has been elected a Fellow of IEEE and a Fellow of ASME.
He held adjunct faculty appointments at Cornell University, Binghamton University, University of Washington, and visiting faculty appointment at Hong Kong University of Science of Technology. He received his B.Sc. at University of London, M Sc at Brown University and PhD at Cornell University.