• Rolf Aschenbrenner, Fraunhofer IZM Berlin, Germany

• Chair: Eric Beyne, IMEC Leuven, Belgium
• Co-Chair: Andrew Richardson, University of Lancaster, UK
• Rolf Aschenbrenner, Fraunhofer IZM Berlin, Germany
• Christian Bosshard, CSEM, Switzerland
• Alan Brown, QinetiQ, UK
• Bernd Römer, Infineon Technologies, Germany
• Stoyan Stoyanov, University of Greenwich, UK
• Changhai Wang, Heriot-Watt University, UK
• Thomas Zerna, Technical University of Dresden, Germany

• Chair: Johan Liu, Chalmers University Göteborg, Sweden
• Co-Chair: Nevil Mattey
• Mohamad Alam, University of Greenwich, UK
• Markus Detert, TU Dresden, Germany
• Jan Felba, Wroclaw University of Technology, Poland
• David Hutt, University of Loughborough, UK
• Patrick Webb, Loughborough University, UK

• Chair: Torsten Wipiejewski, Firecomms Cork, Ireland
• Co-Chair: Paul P. Conway, Loughborough University, UK
• Giovanni Del'Rosso, PIRELLI LABS, Milan, Italy
• Ulrich H. P. Fischer-Hirchert, University of Applied Sciences Harz, Wernigerode, Germany
• Flora Ho, Hong Kong Applied Science & Technology Research Institute Co. Ltd. (ASTRI)
• Klaus-Dieter Lang, Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM), Berlin, Germany
• Tapani Levola, Nokia Corporation, Tampere, Finland
• Dave Milward, Xyratex, Hants, UK
• Andrew Shapiro, JPL, Pasadena, USA
• Jim Watts, Plastic Logic Limited, Cambridge, UK

• Chair: David Whalley, Loughborough University, UK
• Co-Chair: Zsolt Illyefalvi-Vitez, Budapest University of Technology and Economics, Hungary
• Teo Kiat Choon, National University of Singapore
• James M. Gilbert, University of Hull, UK
• Thomas Herzog, TU Dresden, Germany
• Chris Hunt, NPL, UK
• Pavel Mach, Technical University Prague, Czech Rep.
• Ajay P. Malshe, University of Arkansas, USA
• Dongkai Shangguan, Flextronics, USA

• Chair: Diddier Cottet, ABB, Switzerland
• Co-Chair: Mark Johnson, University of Nottingham, UK
• Bruno Allard, INSA Lyon, France
• Braham Ferreira, TU Delft, NL
• Hiromichi Ohashi, AIST, Japan
• Khai Ngo, Virginia Tech, USA

• Chair: Kouchi Zhang, NXP Semiconductors, Netherlands
• Co-Chair: Hans-Jürgen Albrecht, Siemens Berlin, Germany
• Y.C. Chan, City University of Hong Kong, Hong Kong
• Changqing Liu, Loughborouh University, UK
• John Pang Hock Lye, Nanyang Technological University, Singapore
• Wolfgang H. Müller, TU Berlin, Germany
• Nihal Sinnadurai, CPMT UK&RI, UK
• Steffen Wiese, TU Dresden, Germany
• Chunyan Yin, University of Greenwich, UK

• Chair: Bernd Michel, Fraunhofer IZM Chemnitz, Germany
• Co-Chair: Flavio Canavero, Politecnico di Torino, Italy
• Chris Bailey, University of Greenwich, UK
• Willem Van Driel, NXP Semiconductors, Nijmegen, NL
• Rainer Dudek, MicroMaterials Center Cemnitz, Fraunhofer IZM, Germany
• Ephraim Suhir, University of California at Santa Cruz, USA

• Chair: Klaus-Jürgen Wolter, Dresden University of Technology, Germany
• Co-Chair: Jorma Kivilahti, Helsinki University of Technology, Finland
• Ricky Lee, Hong Kong University of Science and Technology, Hong Kong
• Toni Mattila, Helsinki University of Technology, Finland
• Jim Morris, Portland State University, Oregon, USA
• Peter Mueller, IBM Research Laboratory, Switzerland
• Kazunori Yamamoto, Hitachi Cemicals, Japan

• Chair: Jörg Bagdahn, Fraunhofer IWM Halle, Germany
• Co-Chair: Andrzej Dziedzic, Wroclaw University, Poland
• Shuhei Nakamura, Mie University, Japan
• Uwe Partsch, Fraunhofer IKTS Dresden, Germany
• Neil White, University Southampton, UK

• Chair: Tony Corless, University of Newcastle, UK
• Co-Chair: Marc Desmulliez, Heriot-Watt University Edinburgh, UK
• Mayur Patel, University of Greenwich, UK
• Jürgen Uhlemann, TU Dresden, Germany

• Chair: Paul Collander, IMAPS Europe
• Co-Chair: Andy Longford, IMAPS UK
• Darko Belavic , HIPOT + Jozef Stefan Institute, Sentjernej, Slovenia
• Michael Caggiano, Rutgers University, Piscataway, New Jersey, USA
• Pavel Mach, Technical University Prague, Czech Rep.
• Johann Nicolics, Vienna Technical University, Austria
• Angelika Paproth, TU Dresden, Germany
• Alena Pietrikova, Technical University of Kosice, Slovakia
• Dan Pitica, Technical University Cluj-Napoca, Romania

• Chair: Bernard Courtois, TIMA-CMP Grenoble, France
• Co-Chair: Paul Svasta, University of Bucharest, Romania
• Al Puttlitz, IEEE-CPMT, USA
• Hua Lu, University of Greenwich, UK
• Giovanni Del'Rosso, IMAPS-Europe, Italy
• W. Nakamaya, Therm Tech International, Japan