Submission of Abstract:    31st January 2008
Notification of Acceptance:    8th April 2008
Submission of Manuscripts:    31st May 2008

Authors from industry and academia with innovative research and developments are invited to submit abstracts for this forthcoming international conference. Abstracts must be between 250 and 500 words and must include results and graphics. Papers from industry are especially welcome and these necessarily will have product content. However, commercially oriented material and descriptions are not permitted either in the paper or in the presentation of poster.

Authors must identify two appropriate categories for abstract review. All submissions must be in English and should be submitted to the abstract submission system.

To submit an Abstract you need to be registered as an author. You can do this by selecting the menu link "Author Registration" in the "User Management" section. Once registered you will need to authenticate your author account by clicking on the welcome e-mail sent to the address you specified upon sign-up. Once authenticated you will have full member access to all the Abstract submission and editing areas of the website.

Please note: Even if you want to submit MULTIPLE Abstracts it is only necessary to register as an author ONCE!

You are invited to submit an abstract presenting new research or development in the following categories:

Advanced Packaging: New packaging technologies, systems packaging, designs, materials, and configurations addressing performance, density and thermal management for single chip, multichip, wafer-level, MEMS and power packages. Special emphasis on flip-chip, fine pitch and high lead count packaging in CSP, BGA, CGA, LGA and SMT packages, SiP and SoP solutions.

Emerging Technologies: Nano-Scale Packaging, micro-to-nano transition and interfaces. Packaging of nano-scale electronic and sensing devices. Nano-materials, nano-patterning, nano-interconnections, and characterization. Nano-electro-mechanical systems (NEMS). Packaging of biomedical devices. Microfluidic devices. Biocompatible materials. Integrated biotech devices using sample preparation, processing and data communication, test procedures and results.

Electronics system-integration for Healthcare: Medical implants (function restoration, e.g. Cochlear implants; function maintenance, e.g. heart pacemaker; neuromodulation, e.g. pain suppression); Surface stimulation; Personal healthcare systems; Power sources, including ambient power;  Diagnostic, Monitoring or Therapeutic elements enabled by Microfluidics or MEMS; Bio-materials and their integration to micro-electronic manufacturing flows; Ethics in healthcare technologies; Minimally invasive surgical systems technologies.

Manufacturing and Test Technologies: Advanced process development and equipment improvement for wafer thinning, bumping, stacking, and low-k chip packaging, high-density interconnect and embedded component substrates, testing and burn-in. Emphasis on product level integration and optimization for different product applications, cost, yield, performance and environmental improvements, process characterization, new product introduction and ramp, design for flexible manufacturing and testing.

New Materials & Processes: Advancements in adhesives, encapsulants, underfills, solder alloys, ROHS compliant materials, magnetic and optical material, flexible dielectrics, ceramics, composites, thin film processes on laminates, nano-materials, thermal materials, bonding and plating processes. Advances in assembly processes.

Modelling, Simulation and Design: Thermal, Mechanical and Electrical modelling, simulation and design techniques. Multi-physics/scale modelling and optimisation techniques for electronics system integration. DfX techniques for reliability, test, and environment. Characterization of packaging solutions including system-level applications. Prediction of thermal and mechanical performance of packages and modules. Thermal design.

Optoelectronics: Packaging for fiber-optic modules, infra-red wireless, consumer optoelectronics, flat-panel, projection and microdisplays, solid state lighting, optical amplifiers, lasers, detectors, OEICs, optical data interconnect, optical backplanes, passive components, and WDMs.

Technology and Reliability for Nano and Micro Structures: Component, board and system level reliability assessment, failure analysis, advances in reliability test methods and failure analysis, failure and acceleration models, qualification of components and systems, KGD, incremental quality improvement. Physics of Failure techniques, Prognostics and Health Management.

Power Electronics: Advanced Package Materials, Baseless Packages, Spring and Pressure Contacts, Ribbon Bonding, High Voltage Insulation, Ultra High Power Density Integration, SiC Packaging, Passives and Magnetics Integration, Reliability and Lifetime Estimation, Modelling and Simulation, High Temperature Applications, Advanced Cooling Techniques, Double Side Cooling

Assembly of Alternative Energy Sources: Materials, technology, design, fabrication and various assembling method of alternative energy sources and autonomous microgenerators based e.g. on photovoltaic, thermoelectric or piezoelectric effects as well as processes within fuel cells.

Poster Session: Papers from all categories above are considered. Poster papers will be selected for excellence. Poster authors will be scheduled to make short presentations.

The conference Proceedings is an official IEEE publication. Authors will benefit from the opportunity for papers to be selected from the Conference Proceedings for publication in IEEE CPMT themed journals. Author(s) of Outstanding Technical Paper(s) and Best Student Paper will be selected to receive an award.

You can download a print version of the Call for Papers here.